Qualcomm ahead of CES 2022 in Las Vegas unveiled the next generation of the 3D Sonic Max ultrasonic fingerprint scanner, which has many improvements over the previous generation.
The 3D Sonic Max now covers a larger area, supports dual fingerprint recognition at the same time, offers faster operation and is more secure. Thanks to this, there will soon be smartphones with more efficient under-screen fingerprint scanners and faster response times.
This sensor uses advanced ultrasonic technology to read three-dimensional lines on the user’s fingers. The sensor will generate more accurate fingerprint images even if the finger is wet.
Qualcomm ensures that the new technology implemented in 3D Sonic Max can penetrate the surface of objects such as glass and metal to accurately scan fingerprints. In addition, the company’s ultrasonic sensors currently only cover a small portion of the screen, but the new model covers 17 times the area, and the scanner will be able to do the job in as little as 0.2 seconds. Now you don’t have to touch a specific point at the bottom of the screen. The smartphone should still recognize the fingerprint quickly.
Another new feature that Qualcomm has introduced is that the new sensor also supports the simultaneous reading of two fingerprints. This will improve the security of mobile payments and other apps.
For example, parents will be able to set up certain apps to unlock using two fingerprints (their own and the child’s), so kids will only be able to unlock the phone with parental input. On the other hand, the new 3D Sonic Max uses a more compact and ultra-thin design (only 0.2 mm), so it can be used in thinner smartphones.
